Semiconductor Industry Solutions
Elevate Your Semiconductor Manufacturing Efficiency and Security with IHSE’s Advanced KVM Technology
Driving the Future: Semiconductor Industry Growth and Innovation
The semiconductor industry is a cornerstone of modern life. According to Mordor Intelligence, it is projected to reach a total size of $1.2 trillion by 2030, with a CAGR of around 11%. This significant growth is driven by advancements in Data Centers, AI, autonomous driving, and IoT (Internet of Things).
The chipset design and fabrication process requires specialized and expensive machinery, along with a highly skilled workforce. Mordor Intelligence anticipates the need for an additional 1 million highly skilled workers by 2030. Supply chain disruptions caused by COVID-19 and geopolitical issues have led many regions to build resilient production capacities.
Driven by higher data speeds, lower power consumption, and more dense transistor integration, chip technology is constantly evolving. The infographic below illustrates one example of process evolution in Intel nodes.
Transitioning to higher density nodes requires strict clean room controls, limiting personnel on the fabrication floor as much as possible. Given the large size of fabrication facilities (FABs), efficient workforce utilization is challenging. Automation and remote supervision are key solutions.
Automation itself poses challenges, as diverse machinery, OT, and IT equipment producing vast amounts of data need efficient management. Cybersecurity is critical due to the sensitivity of the data, as any breach could significantly impact production yield.
Chipset Design and Manufacturing Process
Mastering the Complexities of Chipset Production
Before a chipset is released for manufacturing (tape out), it has to pass through frontend design (functional design and testing) and backend design (physical design and testing). After these steps, manufacturing simulation using digital twins is employed, requiring enormous computing power. Once the chip design is ready for tape out, actual production begins. Frontend and backend manufacturing often occur at different sites or even in different regions.
Fronted Manufacturing:
- Thin Film Deposition
- Lithography
- Etchíng
- Cleaning & Polishing
Backend Manufacturing:
- Dicing
- Substrating
- Wire bonding
- Final test
Challenges in the Chipset Manufacturing Process and how KVM Technology Can Help
Solving Chipset Manufacturing Challenges with KVM Technology
Long Distances
Large-scale FABs with long distances between machinery cause workforce inefficiency in clean rooms.
Solution: In addition to local operation, all devices can be controlled remotely with real-time access to software/data and video. One operator could simultaneously monitor multiple machines.
External Control
Diverse OT and IT equipment needs to be controlled without accessing internal firmware or application software.
Solution: KVM Technology is hardware and software agnostic, requiring no driver installation and allowing seamless switching between control PCs and machinery.
Performance
Machinery and network performance should not be affected by automation.
Solution: IHSE KVM solutions utilize a secure non-IP core, avoiding extra load on the MES IP network.
Real-time operation
It is essential to ensure seamless control of machinery and video images.
Solution: IHSE solutions can switch every source in real-time with the latest visual lossless video codecs.
Collaboration
Efficient team collaboration using digital twin technology for production preparation.
Solution: IHSE KVM solutions enable easy team collaboration, allowing real-time sharing of valuable hardware resources and software licenses.
Security
Cybersecurity is crucial to protect manufacturing data and enable efficient MES.
Solution: Proprietary KVM links are non-IP and fully isolated from your IP network, with managed authentication ensuring data security.
Continuous Production
Ensuring 24/7 production availability.
Solution: IHSE products are fully redundant by design, including hot-swappable control and data links and power supplies.
Cost/Energy Efficiency
Minimizing operational costs and carbon dioxide emissions.
Solution: IHSE products are designed for the lowest power consumption and carbon dioxide emissions in the industry.
Example System with Fully Flexible Matrix Solution
IHSE KVM (Keyboard, Video, Mouse) solutions are designed to meet the stringent demands of semiconductor fabs, offering a range of benefits that enhance operational performance and safeguard sensitive operations.
By leveraging a non-IP core, ensuring performance preservation, enabling external control, and promoting cost efficiency and sustainability, IHSE KVM systems help semiconductor manufacturers stay ahead in a competitive market.
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